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DPC (Direct Plated Copper) and DBC (Direct Bonded Copper)
2025-09-21
DPC (Direct Plated Copper) and DBC (Direct Bonded Copper) are two key processes used for coating copper onto the surfaces of ceramic circuit boards (such as Al₂O₃ or AlN). The most fundamental difference between them lies in how the copper layer is bonded to the ceramic substrate. Below, I will explain their differences in detail from multiple perspectives.
2025 CIOE in China Shenzhen
2025-09-13
2025 CIOE Stand 11B67 freut sich auf die Zusammenarbeit mit Ihnen